ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.

Feature

nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.

nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.

nAll the processes are completed without moving the wafer on the same chuck table.

nThe smallest footprint in the world.

nEnvironmental - friendly - subsurface damage reduction without chemicals.

nEnvironmental - friendly - subsurface damage reduction without chemicals.

nSystem configuration