時(shí)間：2019-12-05 瀏覽次數(shù)：2293次
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設(shè)備名稱: |
切割膜 |
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廠家: |
DENKA |
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型號(hào): |
切割膜 |
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年份: |
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設(shè)備狀態(tài): |
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Back Grinding Tape -P Series-
A back grinding tape (hereafter as BG tape) is used for protecting the
circuit surface from scratches, chipping / crack and particle
contamination, during the back-grinding process. The functions of BG
tapes are (1) protecting workpiece surface from contamination, (2)
highly close contact to workpiece and (3) easiness of peeling, and
higher technology to those functions is required with the developments
of jumbo-sized and thinned wafer and high-bumped wafer. Elegrip BG tapes
produced by DENKA do not require to rinse your workpiece after BG
process due to excellent adhesive. We Toyo Adtec consider needs of each
user and choose appropriate tapes.
Feature
Excellent contact to asperity of the circuit side
Effective control of particle
Good water-seepage control
Excellent grinding accuracy (TTV)
Easy peeling
Effective control on adhesive deterioration with time
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Product Number |
Base Film |
Color |
Total Thickness |
Adhesive Thickness |
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BGE-122S |
EVA |
LB |
140 |
20 |
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BGE-122V |
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BGE-1240A6 |
160 |
40 |
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BGE-124S |
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BNY-1250A3 |
170 |
50 |
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BNY-1250A4 |
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BGE-164VC |
200 |
40 |
＊The above data is just for representing value, and not guaranteed value.
＊Color : MW (Milky White), B (Llight Blue), T (Transparent)
＊Separator thickness is not included.
本公司代理日本DENKA Tape，DENKA Tape以前的名稱為Toyo Tape.
DENKA Tape 包括四款膜：
1.BG Tape,研磨保護(hù)膜，其中分UV型和Non UV型。
2.Non UV Tape，切割膜，通常為藍(lán)色或者白色膜。
3.UV Tape，切割膜，也可以用做研磨保護(hù)。
4.Peeling Tape，用于研磨后的揭膜。
應(yīng)用領(lǐng)域：
1.半導(dǎo)體硅片研磨保護(hù)
2.半導(dǎo)體硅片切割工序
3.半導(dǎo)體后段基板/銅框架切割工序
4.陶瓷基板切割工序
5. LED基板切割工序
6.玻璃產(chǎn)品切割工序
特點(diǎn)：
1.作為DENKA指定的代理商，我們?cè)谔K州,深圳工廠備有充足的不同類型，不同尺寸的樣品供我們的客戶選擇試驗(yàn)。
2.我們擁有專門(mén)的UV膜應(yīng)用試驗(yàn)室，可根據(jù)客戶實(shí)際產(chǎn)品來(lái)選擇Tape，提供切割試驗(yàn)，最終評(píng)估我們的產(chǎn)品是否適合客戶的應(yīng)用。
3.我們公司本身接洽研磨切割代工業(yè)務(wù)，對(duì)于常用的膜都備有安全庫(kù)存，對(duì)于我們的客戶，可以提供緊急的調(diào)貨支援。
